Lead-Free N2 Reflow Oven SRF8225NⅡ
Low Nitrogen Consumption
Powerful Heating / Cooling Capability
New System for Countermeasure against Flux
Energy Saving Design (Low Running Cost)
■Low Nitrogen Consumption
SRF8225NⅡ realizes unmatched 150L/mim of nitrogen consumption at 500ppm or above due to Suzuki's unique design in airtight structure and prevention of airflow disorder.
■Low Electricity Consumption
The 8 heating zone reflow oven only consumes approximate 7kw to 10kw of electricity in real board handlings because of its high-insulated structure against the heat.
Heating/Cooling Capability (Powerful Heating/Cooling Capability Plus Temperature Uniformity)
SRF8225NⅡ, equipped with newly designed heat air blowing panels that generate epoch-making and uniform airflow quality and offer powerful heating capability, assures more flexibility and repeatability in temperature profile performance even on boards with high thermal capacity and thus realize the world- class low ΔT. The reflow oven also possesses powerful cooling capability with a new cooling system (upper and lower side) in the last 2 zones.
|Lower than ΔT2°C||・250×330×1.6（mm）
・7 points inspected, 10mm from the edge of the plate
Countermeasure against Flux (Extended Maintenance Cycle)
■Flux Resolution by Catalyst
Equipped with the resolution function of flux by catalyst, SRF8225NⅡ resolves heavy bicarbonate hydrogen, which is source of stickiness and dirt inside the zones.
■All Zone Flux Collection System
Water-cooling flux collection system in each zone enhances efficiency in collecting flux.
Adoption of Titanium Conveyor Rails
Use of titanium conveyor rails made by water jet process offers excellent heat resistant to minimize warps on the conveyor rails. Their hollow structures also contribute to achieving the low ΔT.
Water-cooling unit is installed in each cooling zone to chill boards sharply under stable nitrogen atmosphere.
■Board Transfer Rollers
Board transfer rollers assist small boards to be transferred to/from other in-line SMT equipments.
■Adjustable Board Entrance/Exit Labyrinth System
(Upper side:10,15,20,25mm / Lower side:15,20,25mm)
Adjustable board entrance/exit labyrinth system serves to minimize outflow of N2 gas from the oven.
A state of art 7 channel temperature profiler is selected as an option, which provides instant "Pass/Fail" judgment on set reflow condition, a real-time temperature indicator and template as well as full report on each channel, automatic calculation of ΔT, and automatic start/end measurement function. The profile screen that holds fundamental data such as thermal condition and conveyor speed can be saved as data for easy production management.
■Automatic Adjustment of Conveyor Width
Computer-controlled automatic adjustment of conveyor width is available as an option to reduce changeover time in many-kinds low-volume production.
■Automatic Conveyor Chain Oil Dispenser
Computer-controlled automatic lubrication on conveyor chains offers hands-off maintenance.
■Peak Electricity Reduction System
Peak electricity consumed during warm-up can be reduced by Suzuki's unique power control system.
■Board Warp Prevention System
UPS supplies electricity to unload boards out of oven at power failure in factory.
|Dimensions||4,446(L)×1,090(W)×1,350(H)mm (Excluding Projection)|
Mounted component height: ±25mm
|Zone||Heating: 8 zones
Cooling: 2 zones
|PCB Holding||3mm from PCB edge|
|Controller||PLC (Main) PC (Display, Operation, and Profiler)|
|Utilities||Air Supply : 0.5MPa Clean and Dry Air
N2 Gas Supply: 0.5MPa (max: 150 /min.)
|Power Supply||3 phases 200V±10V 50/60Hz 35kVA|
High Speed Dispenser CPD-1000
Achieves Dispensing Tact Time at 0.07sec/shot.
Continues High Precision Dispensing by Reliable Structure.
Meets Wider Dispensing Needs with Variety Options.
|PCB Size||50×50～460×360mm (～510×460mm (VL)) t=0.3～4.0mm (less than 0.5mm:option)|
|Dispense Head||3 Heads|
|Kind of the nozzles||Twin Nozzle (Small, Medium, Large)|
|Dispensing Accuracy||±0.10 mm|
|Dispensing Tact Time||0.07 sec / dot (at optimum condition)|
|Dispensing Rotation||0°±90° (1°step)|
|Dispensing Condition Settings||240 programmable channels|
Low Level Warnin
|PCB Positioning||Alignment Mark Recognition (Standard)|
|Conveyor Width||Automatic (Standard)|
|Power Supply||Single phaze 200, 220, 230, 240V ±10% 50/60Hz
|Air Supply||0.5MPa Clean and Dry Air|
LED flip-chip mounting device BDM-1000
Flip-chip mounting through innovative direct wafer
Next generation rapid productivity which far outperforms existing bonders
First ACP batch wafer transfer system in the world
Mini LED compatible
Self-alignment control through optimization of ACP membrane