Product Information

High Speed Dispenser CPD-1000

CPD-1000写真

 

Feature

EnableFurther Small Components by Jet Dispense Head
Achieves Top Class Dispensing Tact Time
Continues High Precision Dispensing by Reliable Structure
Meets Wider Dispensing Needs with Variety Options

SPECIFICATIONS

PCB Size 50×50~460×360mm (typeXD)
50×50~510×460mm (typeXL)
Dispense Method Piezo Type Jet, Air Pulse
Dispense Head 1~3 Head(s)
Dot(s)/shot 1 dot/shot (Jet Head), 1~4 dot(s)/shot (Air Head)
Dispense Speed
(at Optimum Condition)
0.05sec/shot (Jet Head)
0.07sec/shot (Air Head)
Accuracy ±50μm
Rotation ±90°, (±180°:  Option)
Nozzle 1~4 dot(s), Center Stopper, Non-Contact, etc.
Syringe 30cc (10cc, 20c :  Using Adapter)
Conveyor Automatic Width Adjustment
OS Windows10
Operation Touch Panel
Air Supply 0.5MPa Clean and Dry Air (40Nl/min)
Power Supply Single phase 200, 220V, 3.0kVA (XD), 6.0kVA (XL)

 

Size

cpd-size

Lead-Free N2 Reflow Oven SRF8225NⅡ

Lead-Free N2 Reflow Oven SRF8225NⅡ

Feature

Low Nitrogen Consumption
Powerful Heating / Cooling Capability
New System for Countermeasure against Flux

SPECIFICATIONS

Dimensions 4,446(L)×1,090(W)×1,350(H)mm (Excluding Projection)
Conveyor Height 900±30mm
PCB Size 40×50~250×330mm
Mounted component height: ±25mm
Zone Heating: 8 zones
Cooling: 2 zones
PCB Holding 3mm from PCB edge
Controller PLC (Main) PC (Display, Operation, and Profiler)
Utilities Air Supply : 0.5MPa Clean and Dry Air
N2 Gas Supply: 0.5MPa (max: 150 /min.)
Power Supply 3 phases 200V±10V 50/60Hz 35kVA
Weight Approx. 1,500kg

Zone Configuration

Zone Configuration

Size

Size
 

 

LED flip-chip mounting device BDM-1000

LED flip-chip mounting device BDM-1000

Features

Flip-chip mounting through innovative direct wafer
Next generation rapid productivity which far outperforms existing bonders
First ACP batch wafer transfer system in the world
Mini LED compatible
Self-alignment control through optimization of ACP membran