High Speed Dispenser CPD-1000
Feature
EnableFurther Small Components by Jet Dispense Head
Achieves Top Class Dispensing Tact Time
Continues High Precision Dispensing by Reliable Structure
Meets Wider Dispensing Needs with Variety Options
SPECIFICATIONS
| PCB Size | 50×50～460×360mm (typeXD) 50×50～510×460mm (typeXL) |
| Dispense Method | Piezo Type Jet, Air Pulse |
| Dispense Head | 1~3 Head(s) |
| Dot(s)/shot | 1 dot/shot (Jet Head), 1～4 dot(s)/shot (Air Head) |
| Dispense Speed (at Optimum Condition) |
0.05sec/shot (Jet Head) 0.07sec/shot (Air Head) |
| Accuracy | ±50μm |
| Rotation | ±90°, (±180°: Option) |
| Nozzle | 1～4 dot(s), Center Stopper, Non-Contact, etc. |
| Syringe | 30cc (10cc, 20c : Using Adapter) |
| Conveyor | Automatic Width Adjustment |
| OS | Windows10 |
| Operation | Touch Panel |
| Air Supply | 0.5MPa Clean and Dry Air (40Nl/min) |
| Power Supply | Single phase 200, 220V, 3.0kVA (XD), 6.0kVA (XL) |
Size
Lead-Free N2 Reflow Oven SRF8225NⅡ
Feature
Low Nitrogen Consumption
Powerful Heating / Cooling Capability
New System for Countermeasure against Flux
SPECIFICATIONS
| Dimensions | 4,446(L)×1,090(W)×1,350(H)mm (Excluding Projection) |
| Conveyor Height | 900±30mm |
| PCB Size | 40×50～250×330mm Mounted component height: ±25mm |
| Zone | Heating: 8 zones Cooling: 2 zones |
| PCB Holding | 3mm from PCB edge |
| Controller | PLC (Main) PC (Display, Operation, and Profiler) |
| Utilities | Air Supply : 0.5MPa Clean and Dry Air N2 Gas Supply: 0.5MPa (max: 150 /min.) |
| Power Supply | 3 phases 200V±10V 50/60Hz 35kVA |
| Weight | Approx. 1,500kg |
Zone Configuration
Size
LED flip-chip mounting device BDM-1000
Features
Flip-chip mounting through innovative direct wafer
Next generation rapid productivity which far outperforms existing bonders
First ACP batch wafer transfer system in the world
Mini LED compatible
Self-alignment control through optimization of ACP membran